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Whether you’re moving a single piece of equipment or an entire production line, our trusted team of engineers can support every step of your move, from rigging to end-to-end relocation support across the globe.

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scia Mill 200

The scia Mill 200 is designed for structuring complex multilayers of various materials. It offers precise process control with customisable endpoint detection systems. Featuring full reactive gas compatibility, the system enables reactive etching with enhanced selectivity and rate. Its flexible design allows adaptation for both single-substrate applications and high-volume production cluster configurations, with up to three process chambers and two cassette load locks.

Key Features:

  • Etching angle adjustment with tiltable and rotatable substrate holder
  • Excellent uniformity without shaper
  • Enhanced selectivity and rate with reactive gases
  • Process control with exact SIMS based or optical end point detection
  • Processing of wafers with photoresist masks due to good wafer cooling
  • Fully automatic cassette handling in variable cluster layouts including SECS/GEM communication

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